SEI לייזר PAPER BLASTER 02SEI Laser
PAPER BLASTER 02
SEI לייזר PAPER BLASTER 02
SEI Laser
PAPER BLASTER 02
שנת ייצור
2008
מצב
משומש
מיקום
פולין 

נתונים בסיסיים
- שם המכונה:
- SEI לייזר PAPER BLASTER 02
- יצרן:
- SEI Laser
- דגם:
- PAPER BLASTER 02
- שנת ייצור:
- 2008
- מצב:
- מוכן לעבודה (יד שניה)
מחיר ומיקום
- מיקום:
- , פולין

התקשר
פרטים טכניים
לייזר
הספק לייזר:
115,000 וואט
פרטים נוספים
מספר צירים:
3
פרטי ההצעה
- מזהה מודעה:
- A22840980
- מספר התייחסות:
- PL-CUT-SEI-2008-00001
- עדכון:
- עודכן לאחרונה בתאריך 29.09.2026
תיאור
CO2 laser cutting machine manufactured in 2008. This SEI Laser Paper Blaster 02 features a sealed CO₂ laser with a nominal power of 115 W, designed for paper and cardboard processing. It includes an automatic sheet feeder with a maximum stack height of 350 mm and an integrated conveyor system for efficient operation. If you are looking to get high-quality cutting, marking, and engraving capabilities, consider the SEI Laser Paper Blaster 02 machine we have for sale. Contact us for further details.
Laser system
• Wavelength: ~10.6 µm
• Scanning head: 3-axis galvanometric system
• Axes: X/Y via scanning mirrors; Z with dynamic focusing (per optical setup)
Psdpfx Ajz Hbyysppogt
• Working field: Approx. 200 × 200 to 500 × 500 mm
• Processing modes: Cutting, marking, engraving, micro-perforation
• Adjustable parameters: Laser power, frequency, processing speedPaper handling
• Feeding: Automatic sheet feeder with stack loader
• Max stack height: 350 mm
• Paper weight range: 120–300 g/m²
• Operation: Fully automatic cycle
• Transport: Integrated conveyor system
• Output: Automatic sheet discharge and collectionControl and software
• Control: PC-basedSafety and extraction
• Enclosed laser processing area
• Interlocked access doors
• Laser safety shutters
• Emergency-stop devices
• Fume extraction connections (external unit required)Electrical data
• Supply voltage: 230 V AC, single phase with neutral and PE
• Frequency: 50/60 Hz
• Machine nameplate power: 200 W
• Machine nameplate current: 1 A
Laser system
• Wavelength: ~10.6 µm
• Scanning head: 3-axis galvanometric system
• Axes: X/Y via scanning mirrors; Z with dynamic focusing (per optical setup)
Psdpfx Ajz Hbyysppogt
• Working field: Approx. 200 × 200 to 500 × 500 mm
• Processing modes: Cutting, marking, engraving, micro-perforation
• Adjustable parameters: Laser power, frequency, processing speedPaper handling
• Feeding: Automatic sheet feeder with stack loader
• Max stack height: 350 mm
• Paper weight range: 120–300 g/m²
• Operation: Fully automatic cycle
• Transport: Integrated conveyor system
• Output: Automatic sheet discharge and collectionControl and software
• Control: PC-basedSafety and extraction
• Enclosed laser processing area
• Interlocked access doors
• Laser safety shutters
• Emergency-stop devices
• Fume extraction connections (external unit required)Electrical data
• Supply voltage: 230 V AC, single phase with neutral and PE
• Frequency: 50/60 Hz
• Machine nameplate power: 200 W
• Machine nameplate current: 1 A
המודעה שלך נמחקה בהצלחה
אירעה שגיאה









