Koh-Young 3D Inline SPI 8030-3 L

Koh-Young 8030-3 L

Koh-Young 3D Inline SPI 8030-3 L
Year of manufacture 2012
Gerber conversion software
Easy-to-use software package with touchscreen operation
SPC Plus software
Measurements:
Insufficient, excessive, or no solder paste
Bridge formation
Paste deformation
Volume, height
XY position
Shadow-free measurement via 2-way projection
4 MPix high-speed camera, 20 µm XY resolution, 0.37 µm Z resolution
Approx. 60 cm²/sec inspection speed
Z-axis tracking
SPC Plus software package
PCB size max. 510 x 510 mm
Automatic width adjustment
SMEMA interface
Transport height 950 +/- 50 mm
QR code recognition
2D detection of bridges and smearing
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