צילום רנטגן תלת-ממדי של AOI

GÖPEL X Line 3D AOI/AXI

Automatic X-ray inspection
For the inspection of BGA, QFN, THT, LED, LGA, and other solder joints, visible or hidden.

Other:

Including offline station and repair station
OS: Windows 7
Ultra-high speed line-scan CCD detectors
Inspection area: 450 mm - 400 mm
Image capture: 2D, 2.5D, 3D (layer images with planar CT)
PCB dimensions: 60 - 450 x 50 - 400 mm
AXI resolution: 6 - 30 µm / px
AOI:
Camera field of view: 42 mm x 42 mm
Resolution: 21 µm
Inspection height: -3 to 7.5 mm
Optics: telecentric
Transport height: 950 mm +/- 25 mm
Interface: SMEMA
Width adjustment: automatic
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