2010 קליבלנד G-APU 5

Cleveland G-APU 5

Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package).

Accessories:

Total enclosure,

Camera system, image field 20 x 16 mm

Extraction system 4000/3 D 240 3kW 630 m³/h

Swivel unit for package dressing

Fpsdpfxsy Tl Iaj Aigoi
Software for converting DXF files to CNC files on PC

Touchscreen

Standard software for straight, bevel or radii etc. DXF files.
Single Diamond- / CBN grinding wheel diameter: 400 mm
Single-disc width: 30 mm
Packages: packages to Ø 150 mm and width 150 mm
Swivel axis: swivel plate for swivel angle: +/- 95 degrees
Delivery axis travel: 82 mm
Oscillation hub : 83 mm
Spindle mounting diameter: 60 mm
DIA/CBN wheel flange hole: 32 mm
Speed of silicon wafer: 700 - 2800 rpm
SIC Grinding Spindle: 60 mm Ø
Workpiece clamping X-axis travel: 185 mm
Y-axis travel: 194 mm
Workpiece spindle head holder diameter : 100 mm
with belt spindle diameter : 100 x 200 mm
Grinding wheel balance: max. 40 kg
Workpiece spindle speed: 500 - 1500 rpm
SIC discs up to max.: 200 x 20 mm x 32 mm
Connected load: approx. 2.5 kW (400 Volts / 50 Hz)
Dimensions W x D x H: 2000 x 2000 x 2600 mm
weight: 1200 kg
colour: red RAL 3003 / grey RAL 7035