קליבלנד G-APU 5 משנת 2017

Cleveland G-APU 5

Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels.

Accessories:

Total enclosure,

Camera system with 7x motorized zoom video system, plus 10x digital zoom

Extraction system 4000/3 D 240 3kW 630 m³/h

Swivel unit for package dressing

Grinding spindle SK 40

Grinding wheel guard, swivels to the rear

Software for converting DXF files to CNC files on PC
Single-disc width: 30 mm
Swivel axis: swivel plate for swivel angle: +/- 95 degrees
Delivery axis travel: 82 mm
Oscillation hub : 83 mm
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Spindle mounting diameter: 60 mm
DIA/CBN wheel flange hole: 32 mm
Speed of silicon wafer: 700 - 2800 rpm
SIC Grinding Spindle: 60 mm Ø
Workpiece clamping X-axis travel: 185 mm
Y-axis travel: 194 mm
Workpiece spindle head holder diameter : 100 mm
with belt spindle diameter : 100 x 200 mm
Grinding wheel balance: max. 40 kg
Workpiece spindle speed: 500 - 1500 rpm
SIC discs up to max.: 200 x 20 mm x 32 mm
Connected load: approx. 2.5 kW (400 Volts / 50 Hz)
Dimensions W x D x H: 2700 x 2200 x 2200 mm
colour: Grey
weight: 1900 kg
Diamond- / CBN grinding wheel diameter: 400 mm