קליבלנד G-APU 5 משנת 2017

Cleveland G-APU 5

Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package).

Accessories:

Total enclosure,

Camera system with 7x motorized zoom video system, plus 10x digital zoom, image field 25 x 20 mm

Extraction system 4000/3 D 240 3kW 630 m³/h
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Swivel unit for package dressing

Grinding wheel guard, swivels to the rear

Software for converting DXF files to CNC files on PC

Touchscreen

Standard software for straight, bevel or radii.
Single Diamond- / CBN grinding wheel diameter: 400 mm
Single-disc width: 30 mm
Packages: packages to Ø 150 mm and width 150 mm
Swivel axis: swivel plate for swivel angle: +/- 95 degrees
Delivery axis travel: 82 mm
Oscillation hub : 83 mm
Spindle mounting diameter: 60 mm
DIA/CBN wheel flange hole: 32 mm
Speed of silicon wafer: 700 - 2800 rpm
SIC Grinding Spindle: 60 mm Ø
Workpiece clamping X-axis travel: 185 mm
Y-axis travel: 194 mm
Workpiece spindle head holder diameter : 100 mm
with belt spindle diameter : 100 x 200 mm
Grinding wheel balance: max. 40 kg
Workpiece spindle speed: 500 - 1500 rpm
SIC discs up to max.: 200 x 20 mm x 32 mm
Connected load: approx. 2.5 kW (400 Volts / 50 Hz)
Dimensions W x D x H: 2700 x 2200 x 2200 mm
weight: 1900 kg
colour: red RAL 3003 / grey RAL 7035